Transport Phenomena Technologies
Software combining CFD, flow network modeling, and optimization for heat sink array design
Transport Phenomena Technologies (TPT) models software for thermal management of electronics. TPT is developing a heat sink optimization platform that hybridizes computational fluid dynamics, flow network modeling, multi-variable optimization, and hardware-in-the-loop to optimize the geometry and layout of arrays of heat sinks found in telecommunications, computing, and defense hardware. TPT is also developing a compliant vapor chamber technology to eliminate thick thermal interface materials in the form of gap fillers and/or thermal grease in the aforementioned hardware. TPT also uses analytical, numerical, and experimental methods to consult on complex problems involving momentum, heat, and mass transport phenomena.
Georgios Karamanis
Co-Founder & Senior Engineer